昇雲半导体科技(香港)有限公司

This page is the corporate website of Suncloud Semiconductor Technology (Hong Kong) Limited, a leading provider of semiconductor packaging and manufacturing solutions. The company serves global customers in automotive, consumer, communication, computing, and industrial sectors. It operates three business divisions: wafer back grinding tape for bump packaging, advanced packaging solutions, and mechanical processing services. The company prioritizes technology-driven development and quality-based operations, leveraging extensive experience in R&D, production, and management. It provides high-quality products and comprehensive services to customers worldwide, establishing itself as an industry leader with a strong customer base.